Difference between revisions of "Pcb checklist"
From DIDEAS Wiki
m (Created page with "=before routing= -turn on layer 8, the assembly, and mask layers and remove unwanted text. =during panalization= -shrink mounting hole pads to just larger than the hole -view a...") |
m |
||
| Line 1: | Line 1: | ||
=before routing= | =before routing= | ||
| − | + | *turn on layer 8, the assembly, and mask layers and remove unwanted text. | |
| + | *for the board outline, use 2 mill on the board layer | ||
| + | *for route and retain use the title layer (60 mills wide) | ||
| + | *typically place 5 mounting holes of 10/20 spaced at 20 mills. | ||
=during panalization= | =during panalization= | ||
| − | + | *shrink mounting hole pads to just larger than the hole | |
| − | + | *view assembly and mask layers; verify there is no small text | |
| − | + | *look at silk layers for small text | |
Revision as of 19:43, 2 February 2011
before routing
- turn on layer 8, the assembly, and mask layers and remove unwanted text.
- for the board outline, use 2 mill on the board layer
- for route and retain use the title layer (60 mills wide)
- typically place 5 mounting holes of 10/20 spaced at 20 mills.
during panalization
- shrink mounting hole pads to just larger than the hole
- view assembly and mask layers; verify there is no small text
- look at silk layers for small text
